Citation: Jianhui Chen, Renping Ma, Dan Yang, Ruiwen Tian, Longlong Cui, Wang Guan, Yan Liu, Dianpeng Qi, Gongwei Tian, Chengyu Wang. Adhesive flexible bioelectronics: Current status and future challenges[J]. Chinese Chemical Letters, ;2026, 37(12): 112773. doi: 10.1016/j.cclet.2026.112773 shu

Adhesive flexible bioelectronics: Current status and future challenges

    * Corresponding author at: MIIT Key Laboratory of Critical Materials Technology for New Energy Conversion and Storage, National and Local Joint Engineering Laboratory for Synthesis Transformation and Separation of Extreme Environmental Nutrients, School of Chemistry and Chemical Engineering, Harbin Institute of Technology, Harbin 150001, China.
    ** Corresponding authors.
    E-mail addresses: dpqi@hit.edu.cn (D. Qi), tiangongwei521@163.com (G. Tian), wangcy@nefu.edu.cn (C. Wang).
    1 These authors contributed equally to this work.
  • Received Date: 26 October 2025
    Revised Date: 6 March 2026
    Accepted Date: 14 April 2026
    Available Online: 15 April 2026

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