Citation: Zhao Liu, Junjian Xie, Xiaoming Ren, Muhammad Tahir, Shixin Fa, Qiuyu Zhang. Host-guest interaction mediated low-shrinkage photosensitive positioning adhesive[J]. Chinese Chemical Letters, ;2026, 37(2): 111949. doi: 10.1016/j.cclet.2025.111949 shu

Host-guest interaction mediated low-shrinkage photosensitive positioning adhesive

Zhao Liu ^{a, 1} ,
Junjian Xie ^{a, 1} ,
Xiaoming Ren ^a ,
Muhammad Tahir ^b ,
Shixin Fa ^{a, *,} ,
Qiuyu Zhang ^{a, *,}

a.
Key Laboratory of Special Functional and Smart Polymer Materials of Ministry of Industry and Information Technology, School of Chemistry and Chemical Engineering, Northwestern Polytechnical University, Xi’an 710129, China
b.
School of Chemical Engineering, University of Birmingham, Birmingham, B15 2TT, United Kingdom

sfa@nwpu.edu.cn

qyzhang@nwpu.edu.cn

Received Date: 24 May 2025
Revised Date: 29 September 2025
Accepted Date: 12 October 2025
Available Online: 13 October 2025

Figures(4)

As a common electronic adhesive, ultraviolet (UV) curing polyurethane acrylate adhesive has both flexibility and wear resistance of polyurethane, excellent weather resistance and optical properties of acrylate. Despite the extensive applications, it is still difficult to solve the problems caused by the shrinkage of adhesive. Here, a new type of photosensitive adhesive for bonding electronic components based on supramolecular interaction was designed and synthesized. The supramolecular interaction of cyclodextrin and adamantane moieties introduced into the adhesive polymer entitles the viscosity of the adhesive to rise rapidly during use, thereby preventing adhesive loss and dislocation of electronic components. UV light could further cure the adhesive and position the electronic components. The adhesive shrunk < 2% when cured by UV light, so it can be used for electronic packaging and high-resolution, defect-free lithography.
- Adhesive,
- Host-guest interaction,
- UV-curing,
- Low-shrinkage,
- Lithography
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