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Citation: Fang Jingli, Ding Jianping, Wu Naijun. ELECTROPOLISHING BEHAVIOR OF ORGANOPHOSPHONIC ACID AND CQMPOSITION OF VISCOUS FILM ON ELECTROPOLISHED COPPER SURFACE[J]. Chinese Journal of Applied Chemistry, ;1990, 7(1): 53-57. shu

ELECTROPOLISHING BEHAVIOR OF ORGANOPHOSPHONIC ACID AND CQMPOSITION OF VISCOUS FILM ON ELECTROPOLISHED COPPER SURFACE

1.
Institute of Applied Chemistry, Nanjing University, Nanjing 210008

Received Date: 11 April 1989
Available Online: 6 July 1989

The electropolishing behavior of tive organopolyphosphonic acids has been studied. The results showed that 1-hydroxyethylidene-1,1-diphosphonic acid(HEDP), 1-ethylphosphono-ethylidene-1, 1-diphosphonic acid(EEDP) and N, N'-dimethylidene-phosphonoglycine(DMPG) can be used for electropolishing copper and its allcy,and among them the HEDP gave the best result.Viscous liquid film was observed in all conditions used, such as HEDP concen-trations,pH of solutions and kind of electropolishing solution (H₃PO₄,HEDP, and H₃PO₄+HEDP). Detection of phosphorus in electropolished copper surface was made by XPS and Auger line.No phosphorus was found. The viscous liquid film obtained from H₃PO₄+HEDP solution possesses very good film-forming characteristics., The composition of the viscous film can be established from the constant composition region of the depth profile curve and may be considered to be a polynuclear coordination polymeric compound [Cu₄(PO₄)(HEDP)_n]
- organopolyphosphonic acid,
- electropolishing,
- XPS,
- copper
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