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Citation: WANG Sen-Lin, WU Hui-Huang. Electroless Nickel Plating on Glass Substrate by Palladium-Free Activation[J]. Chinese Journal of Applied Chemistry, ;2003, 20(5): 491-492. shu

Electroless Nickel Plating on Glass Substrate by Palladium-Free Activation

WANG Sen-Lin ^a,, ,
WU Hui-Huang ^b

1.
a College of Materials Science and Engineering, Huaqiao University, Quanzhou 362011;
2.
b State Key Laboratory for Physical Chemistry of Solid Surface, Department of Chemistry, Xiamen University, Xiamen 361005

Corresponding author: WANG Sen-Lin,
Received Date: 29 August 2002
Available Online: 26 February 2003
Fund Project: 国家自然科学基金资助课题(20073035) (20073035)

A new process of electroless plating of nickel on glass substrate without using conventional palladium choride solution activator has been developed.The activation solution consists of nickel acetate,citric acid,and methanol.Heat treatment process of activation solution has been monitored by DTA-TGA and XRD.The results show that the activation solution was completely decomposed into hexagonal Ni and cubic NiO at 310℃.The amorphous electroless deposits was determined by XRD and it contains Ni 88.4% and P 11.6% (mass fraction) by chemical analysis.
- electroless nickel plating,
- palladium-free activation,
- glass
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Electroless Nickel Plating on Glass Substrate by Palladium-Free Activation

南开大学师唯/华北电力大学（保定）刘景维：二维配位聚合物中有序的亲锂冠醚位点用于无枝晶锂沉积

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通讯作者: 陈斌, bchen63@163.com