Citation: Tianqi Bai, Kun Huang, Fachen Liu, Ruochen Shi, Wencai Ren, Songfeng Pei, Peng Gao, Zhongfan Liu. 石墨烯厚膜热扩散系数与微观结构的关系[J]. Acta Physico-Chimica Sinica, ;2025, 41(3): 240402. doi: 10.3866/PKU.WHXB202404024 shu

石墨烯厚膜热扩散系数与微观结构的关系

Tianqi Bai ^1,2 ,
Kun Huang ^3,4 ,
Fachen Liu ^1,2 ,
Ruochen Shi ^1,5 ,
Wencai Ren ^3,4 ,
Songfeng Pei ^3,4 ,
Peng Gao ^1,2,5,6,7,8 ,
Zhongfan Liu ^6,9

1.
Electron Microscopy Laboratory, School of Physics, Peking University, Beijing 100871, China;
2.
Academy for Advanced Interdisciplinary Studies, Peking University, Beijing 100871, China;
3.
Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China;
4.
School of Materials Science and Engineering, University of Science and Technology of China, Shenyang 110016, China;
5.
International Center for Quantum Materials, Peking University, Beijing 100871, China;
6.
Beijing Graphene Institute, Beijing 100095, China;
7.
Collaborative Innovation Center of Quantum Matter, Beijing 100871, China;
8.
Interdisciplinary Institute of Light-Element Quantum Materials and Research Center for Light-Element Advanced Materials, Peking University, Beijing 100871, China;
9.
National Laboratory for Molecular Sciences, College of Chemistry and Molecular Engineering, Peking University, Beijing 100871, China

Received Date: 17 April 2024
Revised Date: 13 June 2024
Accepted Date: 17 June 2024

Fund Project: The project was supported by the National Natural Science Foundation of China (T2188101, 52125307, 52021006, 52273240).

电子元件集成度的快速提升对器件热管理提出了更高的要求。石墨烯凭借其出色的导热性能成为备受关注的材料之一。目前制备高热导率石墨烯厚膜的主流方法是将氧化石墨烯组装成膜再还原，尽管前人的研究取得了突出成效，但截止目前仍未能完全理解石墨烯膜内部缺陷结构对热导率的具体影响机制，这将限制热导率的进一步提升，达到或超过1500 W·m^-1·K^-1。在氧化石墨烯膜的热还原过程中，不可避免地会形成一些孔洞结构，通过降低整体密度的方式降低热导率。热扩散系数作为决定热导率大小的另一因素，孔洞对其影响因素却尚未被研究过。在这里，我们定义了包含孔洞的石墨烯膜材料特有的本征热扩散系数，并通过多种电子显微学方法、热扩散系数的测试和有限元模拟，详细研究了石墨烯厚膜的本征热扩散系数与微观结构之间的关联。我们旨在阐明孔洞对热扩散系数以及热导率的影响方式和作用机制。研究结果揭示了不同尺寸和数量的孔洞对热扩散系数的影响，发现密集小孔洞结构可使热扩散系数降低39.4%，而同等面积的单一大孔洞结构对热扩散系数的降低仅约16.1%。通过三维重构获得的统计结论也与计算结果完全匹配。其内在机制是密集小孔洞结构的存在对原有传热路径的破坏更为严重，而单一大孔洞结构的这一作用则相对较弱，只是降低了整体密度从而降低热导率。此外，研究发现面外结晶性对热扩散系数有显著影响，进一步增进了对影响热扩散系数的微观机理的认识。通过阐明这些机制，我们的研究加深了对石墨烯厚膜微观结构与热学性能关联的理解，为生产超高热导率的石墨烯厚膜提供了重要信息，也为下一代电子器件热管理解决方案提供了有效策略。
- Thick graphene sheets,
- Intrinsic thermal diffusivity,
- Single large hole,
- Dense small holes,
- Out-of-plane crystallinity
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