Citation: Rong Yan, Ling Zhang, Chun-zhong Li. Study on the Construction of 3D-BN Network in Epoxy Resin by Introducing Foam Skeleton[J]. Acta Polymerica Sinica, ;2019, 50(11): 1202-1210. doi: 10.11777/j.issn1000-3304.2019.19064 shu

Study on the Construction of 3D-BN Network in Epoxy Resin by Introducing Foam Skeleton

Key Laboratory for Ultrafine Materials of Ministry of Education, Shanghai Engineering Research Center of Hierarchical Nanomaterials, School of Materials Science and Engineering, East China University of Science & Technology, Shanghai 200237

Corresponding author: Ling Zhang, zlingzi@ecust.edu.cn
Received Date: 1 April 2019
Revised Date: 25 April 2019
Available Online: 10 June 2019

It is a traditional method to improve the thermal conductivity of matrix by adding fillers. However, it is a great challenge to construct a dense heat conduction network in composite material. The current researches on building thermal conductive network is to combine different fillers through structure design for achieving high thermal conductivity with the lowest possible filler content. Due to the electrical insulation requirements of electronic equipment, hexagonal boron nitride (h-BN) has been extensively studied as an inorganic thermal conductive filler. It has a layer structure that shows a relatively high TC of 300 W·m^–1·K^–1 in the h-BN planar direction. In this study, the foam was introduced into the epoxy resin as a skeleton, and thermal conductive network was constructed by immersing the BN/E51 mixture into the foam. By comparing the hot deformation behavior of two kinds of foams with different structures and compositions: polyurethane foam (PF) and nano-melamine (melamine) foam (MF), epoxy resin-based composites with high thermal conductivity were obtained by hot press curing under the right compression ratio. PF has a large single arm size and good elastic deformation ability, but it is easy to become a barrier between BN, which is bad for forming thermal conductive path after compression. However, MF has a small single arm size and can be broken into four needle-like scaffold structures after compression. The needle-like scaffold structure promotes the good dispersion of BN, and finally forms a thermal path of BN throughout the material, which plays a key role in improving the thermal conductivity of the composite. As a result, MF-BN/E51 showed an excellent thermal conductivity of 3.88 W·m^–1·K^–1 at 41 wt% BN load when the degree of hot pressing was 90%. It provides a new way for the composites to achieve a higher thermal conductivity with a less filler load.
- Polyurethane foam,
- Melamine foam,
- Boron nitride,
- Thermal conductive network,
- Thermal conductivity
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