Citation: Shi-yang Wei, Zhi-bo Zheng, Qiao-xi Yu, Zhen-guo Fan, Si-wei Liu, Zhen-guo Chi, Yi Zhang, Jia-rui Xu. Enhanced Thermal Conductivity of PI Films by Strengthening Three-dimensional rGO Network Template[J]. Acta Polymerica Sinica, ;2019, 50(4): 402-409. doi: 10.11777/j.issn1000-3304.2018.18253 shu

Enhanced Thermal Conductivity of PI Films by Strengthening Three-dimensional rGO Network Template

Key Laboratory for Polymeric Composite & Functional Materials of Ministry of Education, Guangdong Key Laboratory of High Performance Polymer Composites, Guangdong Engineering Technology Research Center for High-performance Organic and Polymer Photoelectric Functional Films, School of Chemistry, Sun Yat-sen University, Guangzhou 510275

Corresponding author: Yi Zhang, ceszy@mail.sysu.edu.cn Jia-rui Xu, xjr@mail.sysu.edu.cn
Received Date: 23 November 2018
Revised Date: 2 January 2018
Available Online: 25 February 2019

In this work, high thermal conductive polyimide (PI) composites with reduced graphene oxide (rGO) as filler were prepared. In order to improve the thermal conductivity of rGO in the PI composites, rGO should form heat conductive paths in PI matrix, and the in-plane direction of rGO should be consistent with the heat dissipation direction of composite materials. Therefore, three-dimensional rGO networks (3DrGO) were prepared by freeze-drying technology to construct an effective thermal conductive path in PI matrix. In order to stabilize 3DrGO networks during the preparation process of PI composites, the 3DrGO networks were adhered and reinforced by PI. The process includes: (1) the rGO dispersion containing 3 wt% polyamide acid (PAA) was freeze-dried to prepare the PAA-reinforced 3DrGO network (3DrGO-PAA); (2) the 3DrGO-PAA was treated by thermal imidization to obtain the PI-reinforced 3DrGO network (3DrGO-PI); (3) 10 wt% PAA was cast onto the 3DrGO-PI template and imidized at 100, 200, and 350 °C for 1 h, respectively, at each temperature to obtain the 3DrGO-PI/PI composite films. The 3DrGO-PI/PI composite film exhibits the thermal conductivity of 1.57 W·m⁻¹·K⁻¹ with 8 wt% rGO (772% enhancement compared to that of neat PI film). Whereas the PI composite films with random distributed rGO (rGO/PI composite film) or unreinforced 3DrGO (3DrGO-water/PI composite film) only exhibit the thermal conductivity of 0.51 W·m⁻¹·K⁻¹ (183% enhancement compared to that of neat PI film) or 1.02 W·m⁻¹·K⁻¹ (467% enhancement compared to that of neat PI film), respectively. All the composite films maintain very good thermal stabilities. The T_d5% (thermal decomposition temperature at 5 wt% weight loss) values of the composite films are higher than that at 540 °C. Compared with that of neat PI, the T_gs of the composite films are slightly enhanced and relatively higher (higher than 390 °C). The coefficient of thermal expansion (CTE) of the composite films can be greatly decreased by the addition of 3DrGO. The CTE of 3DrGO-PI/PI composite film is as low as 2.16 × 10^–5/°C when loading 8 wt% 3DrGO.
- Polyimide,
- High thermal conductivity,
- Reduced graphene oxide,
- 3D structure,
- Casting
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