Citation: Yan Yan Feng, Min Gu, Yun Gui Du. Electrocrystallizations of copper on glassy carbon in CuCl₂ silica sol and aqueous solutions[J]. Chinese Chemical Letters, ;2012, 23(2): 249-252. doi: 10.1016/j.cclet.2011.11.020 shu

Electrocrystallizations of copper on glassy carbon in CuCl₂ silica sol and aqueous solutions

State and Local Joint Engineering Laboratory of Methane Drainage in Complex Coal Gas Seam, State Key Laboratory of Coal Mine Disaster Dynamics and Control, Chongqing University, Chongqing 400044, China

Received Date: 30 August 2011

Fund Project: This work was supported by Academic Program of Natural Science Foundation Project of CQ CSTC (No. 2008BC4003) and the Foundation of State Key Laboratory of Physical Chemistry of Solid Surfaces of Xiamen University (No. 2007).

Electrocrystallizations of copper from both CuCl₂ silica sol and aqueous solutions were studied by the chronoamperometry technique. It was found that current density contributions of the double-layer charging (i_DL) in current-time transients (CTTs) from both of the solutions were large. An adsorption-nucleation based model was proposed to analyze quantitatively the CTTs, by which copper electrocrystallization mechanism was characterized as progressive nucleation with 3D growth (3DP) under diffusion control. The diffusion coefficient of copper ions and the AN_∞ products in aqueous solutions were larger than that in silica sols, which indicated that copper nucleation was inhibited in sol solution. The large i_DLDL may be resulted from the adsorption of chloride ions on the electrode surface.
- CuCl₂,
- Silica sol,
- Aqueous,
- Current-time transients (CTTs),
- Copper,
- Electrocrystallization
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