Citation: Xiao-yan Wei, Bo-xuan Zhao, Ya-zhuo Shang, Yuan-rong Cheng. Rigid Biphenyl-contained Epoxy Resins with Improved Thermal Resistant Properties[J]. Chinese Journal of Polymer Science, ;2017, 35(11): 1428-1435. doi: 10.1007/s10118-017-1975-9 shu

Rigid Biphenyl-contained Epoxy Resins with Improved Thermal Resistant Properties

a.
Key Laboratory for Advanced Materials, School of Chemistry & Molecular Engineering, East China University of Science and Technology, Shanghai 200237, China
b.
Shanghai Wujing Optoelectronics Sci & Tech Co., Ltd, Shanghai 200093, China
c.
Department of Materials Science, Fudan University, Shanghai 200433, China

Corresponding author: Ya-zhuo Shang, shangyazhuo@ecust.edu.cn Yuan-rong Cheng, chengyr@fudan.edu.cn
Received Date: 11 March 2017
Revised Date: 25 April 2017
Accepted Date: 8 May 2017

Fund Project: the National Natural Science Foundation of China 21476072the Natural Science Foundation of Shanghai 13ZR1451300the National Natural Science Foundation of China 51403039

Biphenyl-contained monomer of 1, 4-bis[2-(3, 4-epoxy cyclohexyl ethyl) dimethylsilyl] biphenyl (BP-SiH-EP) was prepared via hydrosilylation reaction of 1, 4-bis(dimethylsilyl) biphenyl (BP-SiH) and 1, 2-epoxy-4-vinylcyclohexane in the presence of Karstedt's catalyst. ¹H-NMR, ¹³C-NMR and FTIR were used to characterize the structure of the obtained monomer. BP-SiH-EP was then cured by methyl hexahydrophthalic anhydride (MeHHPA) with 1-cyanoethyl-2-ethyl-4-methylimidazole as an accelerator. The polymerization behavior was studied by DSC. The results of DMA measurement demonstrate that the cured BP-SiH-EP/MeHHPA can maintain high storage modulus (>1 GPa) in a wide range of temperature up to 176℃. According to the damping factor curve of DMA, cured BP-SiH-EP/MeHHPA exhibits a high glass transition temperature (T_g) of 192℃, which is 20℃ higher than that of cured 1, 4-bis[2-(3, 4-epoxy cyclohexyl ethyl) dimethylsilyl] benzene (DEDSB)/MeHHPA. TGA results show that cured BP-SiH-EP/MeHHPA has good thermal stability (T_5%=339℃) due to the high heat-resistance of rigid biphenyl group. Moreover, the crosslinking density of cured BP-SiH-EP/MeHHPA should be lower than that of cured DEDSB/MeHHPA estimated from their chemical structures, which conflicts with the calculated results based on the rubber elasticity equation. The inconsistence indicates that the calculated crosslinking densities are not comparable, possibly owing to their differences in the rigidity of polymer chains and intermolecular interaction.
- Epoxy resin,
- Hydrosilylation,
- Biphenyl group,
- Thermal property,
- Crosslinking density
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1.
沈阳化工大学材料科学与工程学院沈阳 110142