Citation: JIA Fei, WANG Zhou-Cheng. Electrochemical Study on Electroless Nickel Plating Using Sodium Borohydride as the Reductant[J]. Acta Physico-Chimica Sinica, 2011, 27(03): 633-640. doi: 10.3866/PKU.WHXB20110302
以硼氢化钠为还原剂化学镀镍的电化学研究
English
Electrochemical Study on Electroless Nickel Plating Using Sodium Borohydride as the Reductant
We studied electroless Ni-B plating with sodium borohydride as the reductant by linear sweep voltammetry. The effects of bath solution composition and operating conditions on the cathodic reduction and anodic oxidation were studied. Increases in the concentrations of nickel acetate and sodium borohydride accelerated the reduction of Ni2+ and the oxidation of BH4-, respectively. Ethylenediamine, sodium hydroxide, thiourea and saccharin sodium inhibited both the cathodic and anodic reactions to varying degrees. Additionally, sulfur in the additives promoted the dissolution of nickel. High temperature was beneficial to both the cathodic reduction and anodic oxidation.
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Key words:
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Electroless nickel plating
- / Cathodic reduction
- / Anodic oxidation
- / Polarization
- / Additive
- / Adsorption
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[1]
(1) Deng, Y. Y.; Zhu, J.; Li, L. Chemical Techno-Economics 2002,20 (4), 9.
(1) Deng, Y. Y.; Zhu, J.; Li, L. Chemical Techno-Economics 2002,20 (4), 9.
-
[2]
[邓玉勇, 朱 江, 李 立. 化工技术经济, 2002, 20(4), 9.][邓玉勇, 朱 江, 李 立. 化工技术经济, 2002, 20(4), 9.]
-
[3]
(2) Yao, S. J.; Zhang, Y.; Chu, B. W.; Liang, D. M. World Nonferrous Metals 2005, 1, 26.(2) Yao, S. J.; Zhang, Y.; Chu, B. W.; Liang, D. M. World Nonferrous Metals 2005, 1, 26.
-
[4]
[姚素娟, 张 英, 褚丙武, 梁冬梅. 世界有色金属, 2005, 1, 26.][姚素娟, 张 英, 褚丙武, 梁冬梅. 世界有色金属, 2005, 1, 26.]
-
[5]
(3) Hu, W. B.; Liu, L.; Wu, Y. T. Electroless Mickel Plating Technology on Hard-coated Substrates; Chemical Industry Press: Beijing, 2003; pp 14-25, 35-37.(3) Hu, W. B.; Liu, L.; Wu, Y. T. Electroless Mickel Plating Technology on Hard-coated Substrates; Chemical Industry Press: Beijing, 2003; pp 14-25, 35-37.
-
[6]
[胡文彬, 刘 磊, 仵亚婷. 难镀基材的化学镀镍技术. 北京: 化学工业出版社, 2003: 14-25, 35-37.][胡文彬, 刘 磊, 仵亚婷. 难镀基材的化学镀镍技术. 北京: 化学工业出版社, 2003: 14-25, 35-37.]
-
[7]
(4) Jiang, X. X.; Shen, W. The Fundamentals and Practice of Electroless Plating; National Defence Industry Press: Beijing, 2002; pp 11-25, 181-201.(4) Jiang, X. X.; Shen, W. The Fundamentals and Practice of Electroless Plating; National Defence Industry Press: Beijing, 2002; pp 11-25, 181-201.
-
[8]
[姜晓霞, 沈 伟. 化学镀理论及. 北京: 国防工业出版社, 2002; 11-25, 181-201.][姜晓霞, 沈 伟. 化学镀理论及. 北京: 国防工业出版社, 2002; 11-25, 181-201.]
-
[9]
(5) Li, L. Practical Technology of Electroless Plating; Chemical Industry Press: Beijing, 2004; pp 47-56.(5) Li, L. Practical Technology of Electroless Plating; Chemical Industry Press: Beijing, 2004; pp 47-56.
-
[10]
[李 宁. 化学镀实术. 北京: 化学工业出版社, 2004: 47-56.][李 宁. 化学镀实术. 北京: 化学工业出版社, 2004: 47-56.]
-
[11]
(6) Li, L.; Yuan, G. W.; Li, D. Y. Theory and Technology of Electroless Nickel Alloy Plating; Harbin Institute of Technology Press: Harbin, 2000; pp 62-88.(6) Li, L.; Yuan, G. W.; Li, D. Y. Theory and Technology of Electroless Nickel Alloy Plating; Harbin Institute of Technology Press: Harbin, 2000; pp 62-88.
-
[12]
[李 宁, 袁国伟, 黎德育. 镀镍基合金理论与技术. 哈尔滨: 哈尔滨工业大学出版社, 2000: 62-88.][李 宁, 袁国伟, 黎德育. 镀镍基合金理论与技术. 哈尔滨: 哈尔滨工业大学出版社, 2000: 62-88.]
-
[13]
(7) Morris, J. H.; Gysling, H. J.; Reed, D. Chem. Rev. 1985, 85, 51.(7) Morris, J. H.; Gysling, H. J.; Reed, D. Chem. Rev. 1985, 85, 51.
-
[14]
(8) Amendola, S. C.; Onnerud P.; Kelly, M. T.; Petillo, P. J.; Sharp- ldman, S. L.; Binder, M. J. Power Sources 1999, 84, 130.(8) Amendola, S. C.; Onnerud P.; Kelly, M. T.; Petillo, P. J.; Sharp- ldman, S. L.; Binder, M. J. Power Sources 1999, 84, 130.
-
[15]
(9) Delaunois, F.; Petitjean, J. P.; Lienard, P.; Jacob-Duliere, M. Surf. Coat. Technol. 2000, 124, 201.(9) Delaunois, F.; Petitjean, J. P.; Lienard, P.; Jacob-Duliere, M. Surf. Coat. Technol. 2000, 124, 201.
-
[16]
(10) Sankara Narayanan, T. S. N.; Krishnaveni, K.; Seshadri, S. K. Surf. Coat. Technol. 2003, 82, 771.(10) Sankara Narayanan, T. S. N.; Krishnaveni, K.; Seshadri, S. K. Surf. Coat. Technol. 2003, 82, 771.
-
[17]
(11) Rao, W. L.; Bi, G.; Lu, Q. H.; Wang, H. W. Appl. Surf. Sci. 2005, 240, 28.(11) Rao, W. L.; Bi, G.; Lu, Q. H.; Wang, H. W. Appl. Surf. Sci. 2005, 240, 28.
-
[18]
(12) Krishnaveni, K.; Sankara Narayanan, T. S. N.; Seshadri, S. K. Surf. Coat. Technol. 2005, 190, 115.(12) Krishnaveni, K.; Sankara Narayanan, T. S. N.; Seshadri, S. K. Surf. Coat. Technol. 2005, 190, 115.
-
[19]
(13) Anik, M.; K?rpe, E.; Sen, E. Surf. Coat. Technol. 2008, 202, 1718.(13) Anik, M.; K?rpe, E.; Sen, E. Surf. Coat. Technol. 2008, 202, 1718.
-
[20]
(14) Ambat, R.; Zhou, W. Surf. Coat. Technol. 2004, 179, 124.(14) Ambat, R.; Zhou, W. Surf. Coat. Technol. 2004, 179, 124.
-
[21]
(15) Zhang, D. J.; Shao, H. H.; Jiang, X. Y. Corrosion and Protection 2008, 29, 391.(15) Zhang, D. J.; Shao, H. H.; Jiang, X. Y. Corrosion and Protection 2008, 29, 391.
-
[22]
[张道军, 邵红红, 蒋小燕. 腐蚀与防护, 2008, 29, 391.][张道军, 邵红红, 蒋小燕. 腐蚀与防护, 2008, 29, 391.]
-
[23]
(16) Guo, H. T.; Yao, S. W. Basic Electrochemistry and Its Measurement; Chemical Industry Press: Beijing, 2009; pp 176- 178.(16) Guo, H. T.; Yao, S. W. Basic Electrochemistry and Its Measurement; Chemical Industry Press: Beijing, 2009; pp 176- 178.
-
[24]
[郭鹤桐, 姚素薇. 基础电化学及其测量. 北京: 化学工版社, 2009: 176-178.][郭鹤桐, 姚素薇. 基础电化学及其测量. 北京: 化学工版社, 2009: 176-178.]
-
[25]
(17) Liu, B. H.; Li, Z. P.; Suda S. Electrochim. Acta 2004, 49, 3097.(17) Liu, B. H.; Li, Z. P.; Suda S. Electrochim. Acta 2004, 49, 3097.
-
[26]
(18) Liu, B. H.; Li, Z. P.; Arai, K.; Suda, S. Electrochim. Acta 2005, 50, 3719.(18) Liu, B. H.; Li, Z. P.; Arai, K.; Suda, S. Electrochim. Acta 2005, 50, 3719.
-
[27]
(19) Wang, L. Study on the Electrochemical Behavior of Sodium Borohydride. M. S. Thesis. Chongqing University, Chongqing, 2007.(19) Wang, L. Study on the Electrochemical Behavior of Sodium Borohydride. M. S. Thesis. Chongqing University, Chongqing, 2007.
-
[28]
[王 丽. 硼氢化钠的电化学行为研究[王 丽. 硼氢化钠的电化学行为研究
-
[D]. 重庆: 重学, 2007.][D]. 重庆: 重学, 2007.]
-
[30]
(20) Martins, J. I.; Nunes, M. C.; Koch, R.; Martins, L.; Bazzaoui, M. Electrochim. Acta 2007, 52, 6443.(20) Martins, J. I.; Nunes, M. C.; Koch, R.; Martins, L.; Bazzaoui, M. Electrochim. Acta 2007, 52, 6443.
-
[31]
(21) Liu, B. H.; Yang, J. Q.; Li, Z. P. Int. J. Hydrog. Energy 2009, 34, 9436.(21) Liu, B. H.; Yang, J. Q.; Li, Z. P. Int. J. Hydrog. Energy 2009, 34, 9436.
-
[32]
(22) Wang, S. L. Electrochemistry 2005, 11, 430.(22) Wang, S. L. Electrochemistry 2005, 11, 430.
-
[33]
[王森林. 电化学, 2005, 11, 430.][王森林. 电化学, 2005, 11, 430.]
-
[34]
(23) Hu, G. H.; Wu, H. H.; Yang, F. Z.; Wang, S. L. Electrochemistry 2004, 10, 94.(23) Hu, G. H.; Wu, H. H.; Yang, F. Z.; Wang, S. L. Electrochemistry 2004, 10, 94.
-
[35]
[胡光辉, 吴辉煌, 杨防祖, 王森林. 电化学, 2004, 10, 94.][胡光辉, 吴辉煌, 杨防祖, 王森林. 电化学, 2004, 10, 94.]
-
[36]
(24) Yang, Y. G.; Xu, Y. H.; Zhou, X. Journal of Northern Jiaotong University 2002, 26(3), 74.(24) Yang, Y. G.; Xu, Y. H.; Zhou, X. Journal of Northern Jiaotong University 2002, 26(3), 74.
-
[37]
[杨玉国, 许韵华, 周 曦. 北方大学学报, 2002, 26(3), 74.][杨玉国, 许韵华, 周 曦. 北方大学学报, 2002, 26(3), 74.]
-
[38]
(25) Han, K. P.; Jing, L. F. Metal Finishing 1997, 2, 73.(25) Han, K. P.; Jing, L. F. Metal Finishing 1997, 2, 73.
-
[39]
(26) Ohno, I. Mater. Sci. Eng. 1991, A146, 33.(26) Ohno, I. Mater. Sci. Eng. 1991, A146, 33.
-
[40]
(27) Cui, W. K.; Sun, Y. P.; Wu, A. L. Journal of Taiyuan University of Technology 2007, 38, 499.(27) Cui, W. K.; Sun, Y. P.; Wu, A. L. Journal of Taiyuan University of Technology 2007, 38, 499.
-
[41]
[崔文科, 孙彦平, 武爱莲. 太工大学学报, 2007, 38, 499.][崔文科, 孙彦平, 武爱莲. 太工大学学报, 2007, 38, 499.]
-
[42]
(28) Zhang, L. M.; Fang, J. L.; Yuan, G. W.; Shen, P. H. Practical Additives in Electroplating; Chemical Industry Press: Beijing, 2007; pp 17-50, 356-359.(28) Zhang, L. M.; Fang, J. L.; Yuan, G. W.; Shen, P. H. Practical Additives in Electroplating; Chemical Industry Press: Beijing, 2007; pp 17-50, 356-359.
-
[43]
[张立茗, 方景礼, 袁国伟, 沈品华. 实用电镀添加剂. 北京: 化学工业出版社, 2007: 17-50, 356-359.][张立茗, 方景礼, 袁国伟, 沈品华. 实用电镀添加剂. 北京: 化学工业出版社, 2007: 17-50, 356-359.]
-
[44]
(29) Benballa, M.; Nils, L.; Sarret, M.; Müller, C. Surf. Coat. Technol. 2000, 123, 55.(29) Benballa, M.; Nils, L.; Sarret, M.; Müller, C. Surf. Coat. Technol. 2000, 123, 55.
-
[45]
(30) Yang, F. Z.; Xu, J. Y.; Xie, Z. X.; Xu, S. K.; Zhou, S. M. Acta Phys. -Chim. Sin. 1995, 11, 223.(30) Yang, F. Z.; Xu, J. Y.; Xie, Z. X.; Xu, S. K.; Zhou, S. M. Acta Phys. -Chim. Sin. 1995, 11, 223.
-
[46]
[杨防祖, 许家园, 谢兆雄, 许书楷, 周绍民. 物理化学学报, 1995, 11, 223.][杨防祖, 许家园, 谢兆雄, 许书楷, 周绍民. 物理化学学报, 1995, 11, 223.]
-
[47]
(31) Cheong, W. J.; Luan, B. L.; Shoesmith, D. W. Corrosion Sci. 2007, 49, 1777.(31) Cheong, W. J.; Luan, B. L.; Shoesmith, D. W. Corrosion Sci. 2007, 49, 1777.
-
[48]
(32) Yang, F. Z.; Yang, B.; Lu, B. B.; Huang, L.; Xu, S. K.; Zhou, S. M. Acta Phys. -Chim. Sin. 2006, 22, 1317.(32) Yang, F. Z.; Yang, B.; Lu, B. B.; Huang, L.; Xu, S. K.; Zhou, S. M. Acta Phys. -Chim. Sin. 2006, 22, 1317.
-
[49]
[杨防祖, 杨 斌, 陆彬彬, 黄 令, 许书楷, 周绍民. 物理化学学报, 2006, 22, 1317.]
[杨防祖, 杨 斌, 陆彬彬, 黄 令, 许书楷, 周绍民. 物理化学学报, 2006, 22, 1317.]
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