以硼氢化钠为还原剂化学镀镍的电化学研究

贾飞 王周成

引用本文: 贾飞, 王周成. 以硼氢化钠为还原剂化学镀镍的电化学研究[J]. 物理化学学报, 2011, 27(03): 633-640. doi: 10.3866/PKU.WHXB20110302 shu
Citation:  JIA Fei, WANG Zhou-Cheng. Electrochemical Study on Electroless Nickel Plating Using Sodium Borohydride as the Reductant[J]. Acta Physico-Chimica Sinica, 2011, 27(03): 633-640. doi: 10.3866/PKU.WHXB20110302 shu

以硼氢化钠为还原剂化学镀镍的电化学研究

  • 基金项目:

    国家自然科学基金(20573086)资助项目 (20573086)

摘要:

采用线性电位扫描伏安法研究了以硼氢化钠为还原剂的化学镀镍体系, 考查了镀液组成及工艺条件对化学镀镍硼阴、阳极过程的影响, 结果表明: 乙酸镍和硼氢化钠含量的提高分别促进了Ni2+的还原反应和BH4-的氧化反应; 乙二胺、氢氧化钠以及添加剂硫脲、糖精钠对阴、阳极反应均有不同程度的抑制作用, 同时添加剂中的硫元素加速了镍的氧化; 升高温度有利于阴、阳极反应的进行.

English

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  • 发布日期:  2011-03-03
  • 收稿日期:  2010-09-23
  • 网络出版日期:  2011-01-18
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