Electrocrystallizations of copper on glassy carbon in CuCl2 silica sol and aqueous solutions

Yan Yan Feng Min Gu Yun Gui Du

引用本文: Yan Yan Feng,  Min Gu,  Yun Gui Du. Electrocrystallizations of copper on glassy carbon in CuCl2 silica sol and aqueous solutions[J]. Chinese Chemical Letters, 2012, 23(2): 249-252. doi: 10.1016/j.cclet.2011.11.020 shu
Citation:  Yan Yan Feng,  Min Gu,  Yun Gui Du. Electrocrystallizations of copper on glassy carbon in CuCl2 silica sol and aqueous solutions[J]. Chinese Chemical Letters, 2012, 23(2): 249-252. doi: 10.1016/j.cclet.2011.11.020 shu

Electrocrystallizations of copper on glassy carbon in CuCl2 silica sol and aqueous solutions

  • 基金项目:

    This work was supported by Academic Program of Natural Science Foundation Project of CQ CSTC (No. 2008BC4003) and the Foundation of State Key Laboratory of Physical Chemistry of Solid Surfaces of Xiamen University (No. 2007).

摘要: Electrocrystallizations of copper from both CuCl2 silica sol and aqueous solutions were studied by the chronoamperometry technique. It was found that current density contributions of the double-layer charging (iDL) in current-time transients (CTTs) from both of the solutions were large. An adsorption-nucleation based model was proposed to analyze quantitatively the CTTs, by which copper electrocrystallization mechanism was characterized as progressive nucleation with 3D growth (3DP) under diffusion control. The diffusion coefficient of copper ions and the AN products in aqueous solutions were larger than that in silica sols, which indicated that copper nucleation was inhibited in sol solution. The large iDLDL may be resulted from the adsorption of chloride ions on the electrode surface.

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  • 收稿日期:  2011-08-30
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