Citation: WU Wei-Gang, YANG Fang-Zu, LUO Ming-Hui, TIAN Zhong-Qun, ZHOU Shao-Min. Electrodeposition of Copper in a Citrate Bath and Its Application to a Micro-Electro-Mechanical System[J]. Acta Physico-Chimica Sinica, ;2010, 26(10): 2625-2632. doi: 10.3866/PKU.WHXB20101002 shu

Electrodeposition of Copper in a Citrate Bath and Its Application to a Micro-Electro-Mechanical System

1.
1. College of Chemistry and Chemical Engineering, State Key Laboratory of Physical Chemistry of Solid Surfaces, Xiamen University, Xiamen 361005, Fujian Province, P. R. China;
2. School of Physics and Mechanical & Electrical Engineering, Xiamen University, Xiamen 361005, Fujian Province, P. R. China

Received Date: 20 March 2010
Available Online: 27 September 2010
Fund Project: 国家自然科学基金(20873114, 20833005) (20873114, 20833005)国家重点基础研究发展规划项目(973) (2009CB930703)资助 (973) (2009CB930703)

We investigated the effect of plating parameters on the coating morphology and grain size of copper using a novel citrate bath. The structure and deposit were characterized by X-ray diffraction (XRD) and X-ray photoelectron spectroscopy (XPS), respectively. The copper plating bath was applied to a micro-electro-mechanical system (MEMS). Results show that an even and compact copper coating was obtained for the fine grains using plating parameters of 6g·L^-1Cu²⁺, pH=7.0-8.5, 1-2A·dm^-2, 45 ℃, and bath agitation. The deposit consists of pure copper in a fcc polycrystalline structure.A planar inductor was successfully fabricated by MEMS using this bath and its maximum quality factor was 12.75, which satisfies the design requirements.
- Electrodeposition,
- Citrate,
- Copper,
- Deposit characterization,
- Planar inductor,
- Micro -electro -mechanical system
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