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Citation: LIU Changling, YANG Ning, ZHANG Zeyu. Preparation and Properties of Al₂O₃-Modified Epoxy Resin for Electronic Packaging[J]. Chinese Journal of Applied Chemistry, ;2013, 30(12): 1417-1422. doi: 10.3724/SP.J.1095.2013.30259 shu

Preparation and Properties of Al₂O₃-Modified Epoxy Resin for Electronic Packaging

Fine Mechanics and Physics, Changchun Insitute of Optics, Chinese Academy of Sciences, Changchun 130033, China

Received Date: 21 May 2013
Revised Date: 3 July 2013

Thermal conductivity,thermal expansion coefficient and dielectric constant of liquid epoxy resin filled with Al₂O₃ flakes or particles in single,binary or multiple hybrid particle sizes were investigated. The relationship between enhanced thermal performance and dense packing was studied by the fractal theory. The results show that the modified epoxy resin filled with single Al₂O₃ flakes or particles (~48 μm) exhibit superior comprehensive performance. The best thermal conductivity,dielectric constant and thermal expansion coefficient are obtained when the epoxy resin filled with the binary hybrid particles,where the volume fraction of the smaller particles in the mixed particles is 20%~40%. The particles in various sizes in a close packing pattern form the relatively minimum gap and the highest relative thermal conductivity is obtained when the fractal dimension D value of hybrid particle size is in a suitable range.
- Al₂O₃,
- grain shape,
- modified epoxy resin,
- thermal conductivity,
- thermal expansion coefficient,
- dielectric constant,
- fractal theory
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Preparation and Properties of Al₂O₃-Modified Epoxy Resin for Electronic Packaging