光刻胶中金属离子的去除和定量分析

引用本文: 张卫杰, 陈金平, 于天君, 曾毅, 郭旭东, 王双青, 杨国强, 李嫕. 光刻胶中金属离子的去除和定量分析[J]. 分析化学, 2021, 49(10): 1750-1757. doi: 10.19756/j.issn.0253-3820.211248 shu

Citation: ZHANG Wei-Jie, CHEN Jin-Ping, YU Tian-Jun, ZENG Yi, GUO Xu-Dong, WANG Shuang-Qing, YANG Guo-Qiang, LI Yi. Removal and Quantitative Analysis of Metal Ions in Photoresist[J]. Chinese Journal of Analytical Chemistry, 2021, 49(10): 1750-1757. doi: 10.19756/j.issn.0253-3820.211248 shu

光刻胶中金属离子的去除和定量分析

张卫杰 ^1,3, ,
陈金平 ^{1,
,} ,
于天君 ^1, ,
曾毅 ^1,3, ,
郭旭东 ^2, ,
王双青 ^2, ,
杨国强 ^{2,3,
,} ,
李嫕 ^{1,3,
,}

1.
中国科学院理化技术研究所, 中国科学院光化学转换与功能材料重点实验室, 北京 100190;
2.
中国科学院化学研究所, 中国科学院光化学重点实验室, 北京 100190;
3.
中国科学院大学, 北京 100039

通讯作者: 陈金平,E-mail:chenjp@mail.ipc.ac.cn; 杨国强,E-mail:gqyang@iccas.ac.cn; 李嫕,E-mail:yili@mail.ipc.ac.cn

基金项目:
国家自然科学基金项目（Nos.22090012，U20A20144）和中国科学院仪器研制项目（No.YZQT020）资助。

摘要: 采用巯基树脂为金属离子吸附剂，分析了巯基树脂对光刻胶主体材料中残留的金属催化剂Pd的吸附热力学和动力学行为。在不同温度下，将巯基树脂对Pd的吸附实验数据进行动力学模型拟合，结果表明，巯基树脂对光刻胶中Pd的吸附过程符合拟二级动力学模型，说明此吸附过程受化学吸附控制，光刻胶中的Pd和巯基基团化学螯合作用对吸附起重要作用。等温吸附结果符合Langmuir等温吸附方程，表明光刻胶中Pd在巯基树脂表面倾向于单分子层吸附。在实验温度范围内，随着吸附温度升高，巯基树脂对Pd的最大吸附量由12.68 mg/g提高到17.49 mg/g，表明适当提高吸附温度有助于提高巯基树脂的吸附效率。对光刻胶中的金属离子的综合去除实验结果表明，巯基树脂对光刻胶中Li、Na、Mg、Al、K、Ca、Cr、Mn、Fe、Ni、Cu、Zn、Pd和Sn等金属均有良好的吸附效果，可以使纯化后光刻胶中大部分金属离子达到μg/L量级，与进口金属离子去除系统相比，巯基树脂对光刻胶中Pd的纯化效果更显著，含量从5.9 mg/L降低到0.4 μg/L，对于Na和Ca等高丰度金属离子，可分别降低到11.8和13.0 μg/L，纯化效果有待进一步优化和改进。

关键词:

English

Removal and Quantitative Analysis of Metal Ions in Photoresist

1.
CAS Key Laboratory of Photochemical Conversion and Optoelectronic Materials, Technical Institute of Physics and Chemistry, Chinese Academy of Sciences, Beijing 100190, China;
2.
CAS Key Laboratory of Photochemistry, Institute of Chemistry, Chinese Academy of Sciences, Beijing 100190, China;
3.
University of Chinese Academy of Sciences, Beijing 100039, China

Corresponding author: CHEN Jin-Ping, ; YANG Guo-Qiang, ; LI Yi,

Received Date: 23 March 2021
Revised Date: 11 June 2021
Fund Project:
Supported by the National Natural Science Foundation of China (Nos.22090012, U20A20144) and the Chinese Academy of Sciences (No.YZQT020).

Abstract: Thiol resin was used as an adsorbent to remove metal ions in organic photoresists. The thermodynamics and kinetics of the adsorption of Pd in photoresists were investigated extensively by inductively coupled plasma-mass spectrometry (ICP-MS). The adsorption data of Pd ion under different temperatures followed pseudo-second-order kinetic model, indicating that the adsorption process was controlled by chemical interactions of Pd and thiol groups. The results of isothermal adsorption were fitted well with Langmuir isothermal adsorption model, indicating that Pd in photoresist tended to adsorb monolayer on the surface of thiol resin. With the temperature increased, the maximum adsorption capacity of thiol resin for Pd increased from 12.68 mg/g to 17.49 mg/g, suggesting that appropriately increasing the adsorption temperature was helpful to improve the adsorption efficiency. The comprehensive purification results showed that thiol resin could be considered as a promising adsorbent for removal of Li, Na, Mg, Al, K, Ca, Cr, Mn, Fe, Ni, Cu, Zn, Pd and Sn ions in the photoresist. Most of the metal ions could be removed, with residual concentration down to 1.0 μg/L level. Compared with the Pall purification system, thiol resin was more effective for Pd purification, decreasing the content of Pd from 5.9 mg/L to 0.4 μg/L. However, for abundant metal ions such as Na and Ca with reducing limitation to 11.8 μg/L and 13.0 μg/L, respectively, the purification needs to be further optimized.

Key words:

1. [1]
  KWON Y G, JIN B K, TSUYOKIKO F, YUJI S, MITSURU U. J. Mater. Chem., 2002, 12(1):53-57.KWON Y G, JIN B K, TSUYOKIKO F, YUJI S, MITSURU U. J. Mater. Chem., 2002, 12(1):53-57.
2. [2]
  HUA X F, ENGELMANN S, OEHRLEIN G S, LAZZWERI P, IACOB E, ANDERLE M. J. Vac. Sci. Technol. B, 2006, 24(4):1850-1858.HUA X F, ENGELMANN S, OEHRLEIN G S, LAZZWERI P, IACOB E, ANDERLE M. J. Vac. Sci. Technol. B, 2006, 24(4):1850-1858.
3. [3]
  RATHORE A, POLLENTIER I, SINGH H, FALLICA R, DE SIMONE D, GENDT D. J. Mater. Chem. C, 2020, 8(17):5958-5966.RATHORE A, POLLENTIER I, SINGH H, FALLICA R, DE SIMONE D, GENDT D. J. Mater. Chem. C, 2020, 8(17):5958-5966.
4. [4]
  CAPITANIO D, MIZUNO Y, LEE J. Proc. SPIE, 1999, 3678:684-688.CAPITANIO D, MIZUNO Y, LEE J. Proc. SPIE, 1999, 3678:684-688.
5. [5]
  Translated by HUANG Qing-Hong, Calibrated by HUANG Qing-Mei. China Integrated Circult., 2014, 185:13-26. 黄庆红译, 黄庆梅校. 中国集成电路, 2014, 185:13-26.
6. [6]
  TSENG H S, LING X P. Proc. SPIE., 2002, 4690:809-816.TSENG H S, LING X P. Proc. SPIE., 2002, 4690:809-816.
7. [7]
  ZHU Wan-Jun, ZHAI Xiao-Ying, HUANG Ren-Yao, FENG Yong-Jun, YUAN Mao, CHEN Xu, YANG Wen-Sheng. Chin. J. Anal. Chem., 2018, 46(9):1386-1392. 朱万军, 翟晓颖, 黄人瑶, 冯拥军, 袁懋, 陈旭, 杨文胜. 分析化学, 2018, 46(9):1386-1392.
8. [8]
  LIU Xing-Fen, WANG Ya-Teng, HUA Xiao-Xiao, HUANG Yan-Qin, FENG Xiao-Miao, FAN Qu-Li, HUANG Wei. Chin. J. Anal. Chem., 2016, 44(7):1092-1098. 刘兴奋, 王亚腾, 华笑笑, 黄艳琴, 冯晓苗, 范曲立, 黄维. 分析化学, 2016, 44(7):1092-1098.
9. [9]
  ZENG G Y, HE Y, ZHAN Y Q, ZHANG L, PAN Y, ZHANG C L, YU Z X. J. Hazard. Mater., 2016, 317:60-72.ZENG G Y, HE Y, ZHAN Y Q, ZHANG L, PAN Y, ZHANG C L, YU Z X. J. Hazard. Mater., 2016, 317:60-72.
10. [10]
  WACLAWEK S, LUTZE H V, VRUBEL K, PADIL V V T, CERNIK M, DIONYSIOU D D. Chem. Eng. J., 2017, 330:44-62.WACLAWEK S, LUTZE H V, VRUBEL K, PADIL V V T, CERNIK M, DIONYSIOU D D. Chem. Eng. J., 2017, 330:44-62.
11. [11]
  DURU I, EGE D, KAMAIL A R. J. Mater. Sci., 2016, 51(13):6097-6116.DURU I, EGE D, KAMAIL A R. J. Mater. Sci., 2016, 51(13):6097-6116.
12. [12]
  LEE C G, LEE S, PARK J A, PARK C, LEE S J, KIM S B, AN B, YUN S T, LEE S H, CHOI J W. Chemosphere, 2017, 166:203-211.LEE C G, LEE S, PARK J A, PARK C, LEE S J, KIM S B, AN B, YUN S T, LEE S H, CHOI J W. Chemosphere, 2017, 166:203-211.
13. [13]
  ABBAS K, ZNAD H, AWUAL M R. Chem. Eng. J., 2018, 334:432-443.ABBAS K, ZNAD H, AWUAL M R. Chem. Eng. J., 2018, 334:432-443.
14. [14]
  LI G L, ZHAO Z S, LIU J Y, JIANG G B. J. Hazard. Mater., 2011, 192(1):277-283.LI G L, ZHAO Z S, LIU J Y, JIANG G B. J. Hazard. Mater., 2011, 192(1):277-283.
15. [15]
  HUA R, LI Z K. Chem. Eng. J., 2014, 249:189-200.HUA R, LI Z K. Chem. Eng. J., 2014, 249:189-200.
16. [16]
  YU Q, FEIN J B. Environ. Sci. Technol., 2017, 51(24):14360-14367.YU Q, FEIN J B. Environ. Sci. Technol., 2017, 51(24):14360-14367.
17. [17]
  LITTKE A F, FU G G. Angew. Chem., Int. Ed., 2002, 41(22):4176-4211.LITTKE A F, FU G G. Angew. Chem., Int. Ed., 2002, 41(22):4176-4211.
18. [18]
  SCHEUERMANN G M, RUMI L, STEURER P, BANNWARTH W, MUELHAUPT R. J. Am. Chem. Soc., 2009, 131(23):8262-8270.SCHEUERMANN G M, RUMI L, STEURER P, BANNWARTH W, MUELHAUPT R. J. Am. Chem. Soc., 2009, 131(23):8262-8270.
19. [19]
  SCHROETER F, STRASSNER T. Eur. J. Inorg. Chem., 2017, (36):4231-4236.SCHROETER F, STRASSNER T. Eur. J. Inorg. Chem., 2017, (36):4231-4236.
20. [20]
  PENG X M, WANG Y F, XU J, YUAN H, WANG L Q, ZHANG T, GUO X D, WANG S Q, LI Y, YANG G Q. Macromil. Mater. Eng., 2018, 303(6):1700654.PENG X M, WANG Y F, XU J, YUAN H, WANG L Q, ZHANG T, GUO X D, WANG S Q, LI Y, YANG G Q. Macromil. Mater. Eng., 2018, 303(6):1700654.
21. [21]
  CHEN J P, HAO Q S, WANG S Q, LI S Y, YU T J, ZENG Y, ZHAO J, YANG S M, WU Y Q, XUE C F, YANG G Q, LI Y. ACS Appl. Polym. Mater., 2019, 1(3):526-534.CHEN J P, HAO Q S, WANG S Q, LI S Y, YU T J, ZENG Y, ZHAO J, YANG S M, WU Y Q, XUE C F, YANG G Q, LI Y. ACS Appl. Polym. Mater., 2019, 1(3):526-534.
22. [22]
  ZHANG Qing-Mei, XIANG Ren-Jun, CHENG Ying-Xiang. Res. Environ. Sci., 2010, 23(7):888-891. 张青梅, 向仁君, 成应向. 环境科学研究, 2010, 23(7):888-891.
23. [23]
  ALQADAMI A A, NAUSHAD M, ABDALLA M A, AHAMAD T, ALOTHMAN Z A, ALSHEHRI S M, GHFAR A A. J. Cleaner Prod., 2017, 156:426-436.ALQADAMI A A, NAUSHAD M, ABDALLA M A, AHAMAD T, ALOTHMAN Z A, ALSHEHRI S M, GHFAR A A. J. Cleaner Prod., 2017, 156:426-436.
24. [24]
  DEHGHANI M H, SANAEI D, ALI I, BHATNAGAR A. J. Mol. Liq., 2016, 215:671-679.DEHGHANI M H, SANAEI D, ALI I, BHATNAGAR A. J. Mol. Liq., 2016, 215:671-679.
25. [25]
  AIL R M, HAMAD H A, HUSSEIN M M, MALASH G F. Ecol. Eng., 2016, 91:317-332.AIL R M, HAMAD H A, HUSSEIN M M, MALASH G F. Ecol. Eng., 2016, 91:317-332.
26. [26]
  NAUSHAD M, AHAMAD T, SHARMA G, AL-MUHTASED A H, ALBADARIN A B, ALAM M M, ALOTHMAN Z A, ALSHEHRI S M, GHFAR A A. Chem. Eng. J., 2016, 300:306-316.NAUSHAD M, AHAMAD T, SHARMA G, AL-MUHTASED A H, ALBADARIN A B, ALAM M M, ALOTHMAN Z A, ALSHEHRI S M, GHFAR A A. Chem. Eng. J., 2016, 300:306-316.

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通讯作者: 陈斌, bchen63@163.com

1.
沈阳化工大学材料科学与工程学院沈阳 110142

光刻胶中金属离子的去除和定量分析

通讯作者: 陈金平,E-mail:chenjp@mail.ipc.ac.cn; 杨国强,E-mail:gqyang@iccas.ac.cn; 李嫕,E-mail:yili@mail.ipc.ac.cn

English

Removal and Quantitative Analysis of Metal Ions in Photoresist

Corresponding author: CHEN Jin-Ping, ; YANG Guo-Qiang, ; LI Yi,

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通讯作者: 陈斌, bchen63@163.com

中国化学会秘书处

光刻胶中金属离子的去除和定量分析

通讯作者: 陈金平,E-mail:chenjp@mail.ipc.ac.cn; 杨国强,E-mail:gqyang@iccas.ac.cn; 李嫕,E-mail:yili@mail.ipc.ac.cn

English

Removal and Quantitative Analysis of Metal Ions in Photoresist

Corresponding author: CHEN Jin-Ping, ; YANG Guo-Qiang, ; LI Yi,

CCS Chemistry：嵌段共聚物自组装成 “三明治”二维有机材料，实现纳米级压力传感功能

CCS Chemistry：颜徐州、鲍哲南： 你的皮肤可能是一片SPMs

CCS Chemistry：工作高效不疲劳，只须让催化剂动起来

CCS Chemistry：静电组装导向聚合- 聚电解质纳米凝胶量化制备新策略

CCS Chemistry：金黄色葡萄球菌醛基脱氢酶是如何识别特异性底物的？

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通讯作者: 陈斌, bchen63@163.com

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