铜电极表面铜锡合金电结晶机理

引用本文: 史纪鹏, 杨防祖, 田中群, 周绍民. 铜电极表面铜锡合金电结晶机理[J]. 物理化学学报, 2013, 29(12): 2579-2584. doi: 10.3866/PKU.WHXB201310092 shu

Citation: SHI Ji-Peng, YANG Fang-Zu, TIAN Zhong-Qun, ZHOU Shao-Min. Electrocrystallization of Cu-Sn Alloy on Copper Electrode Surface[J]. Acta Physico-Chimica Sinica, 2013, 29(12): 2579-2584. doi: 10.3866/PKU.WHXB201310092 shu

铜电极表面铜锡合金电结晶机理

基金项目:
国家自然科学基金(21021002) (21021002)

国家重点基础研究发展计划(973) (2009CB930703)资助项目 (973) (2009CB930703)

摘要:

在弱酸性柠檬酸盐体系铜锡合金镀液中, 采用线性扫描伏安(LSV)、循环伏安(CV)和计时安培实验方法, 运用Scharifker-Hills (SH)理论模型和Heerman-Tarallo (HT)理论模型分析拟合实验结果, 研究铜锡合金在铜电极上的电沉积过程与电结晶机理. 结果表明, 铜锡合金在铜电极表面实现共沉积并遵循扩散控制下三维瞬时成核的电结晶过程. 电位阶跃从-0.80 V负移至-0.85 V (vs SCE), HT理论分析得到铜锡合金的成核与生长的动力学参数分别为成核速率常数(A)值从20.19 s^-1增加至177.67 s^-1, 成核活性位点密度数(N₀)从6.10×10⁵ cm^-2提高至1.42×10⁶ cm^-2, 扩散系数(D)为(6.13±0.62)×10^-6 cm²·s^-1.

关键词:

English

Electrocrystallization of Cu-Sn Alloy on Copper Electrode Surface

1.
State Key Laboratory of Physical Chemistry of Solid Surfaces, College of Chemistry and Chemical Engineering, Xiamen University, Xiamen 361005, Fujian Province, P. R. China
Received Date: 30 July 2013
Available Online: 28 November 2013
Fund Project:
国家自然科学基金(21021002)

国家重点基础研究发展计划(973) (2009CB930703)资助项目

Abstract:

The co-deposition and electrocrystallization of Cu-Sn alloy in a weak acidic citrate bath were studied by linear sweep voltammetry (LSV), cyclic voltammetry (CV), and chronoamperometry. The Scharifker- Hill (SH) theory model and Heerman-Tarallo (HT) theory model were applied to analyze the chronoamperometry data. The results show that the Cu-Sn alloy co-deposited on copper electrode, following instantaneous nucleation with three-dimensional (3D) growth under diffusion control. The kinetic parameters were obtained using the HT model. As the step potential shifted from -0.80 to -0.85 V, the nucleation rate constant (A) increased from 20.19 to 177.67 s^-1, the density of active nucleation sites (N₀) increased from 6.10×10⁵ to 1.42×10⁶ cm^-2, and the diffusion coefficient (D) was (6.13±0.62)×10^-6 cm²·s^-1.

Key words:

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1.
沈阳化工大学材料科学与工程学院沈阳 110142

铜电极表面铜锡合金电结晶机理

English

Electrocrystallization of Cu-Sn Alloy on Copper Electrode Surface

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通讯作者: 陈斌, bchen63@163.com

中国化学会秘书处

铜电极表面铜锡合金电结晶机理

English

Electrocrystallization of Cu-Sn Alloy on Copper Electrode Surface

CCS Chemistry：嵌段共聚物自组装成 “三明治”二维有机材料，实现纳米级压力传感功能

CCS Chemistry：颜徐州、鲍哲南： 你的皮肤可能是一片SPMs

CCS Chemistry：工作高效不疲劳，只须让催化剂动起来

CCS Chemistry：静电组装导向聚合- 聚电解质纳米凝胶量化制备新策略

CCS Chemistry：金黄色葡萄球菌醛基脱氢酶是如何识别特异性底物的？

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