引用本文:
高保娇, 高建峰, 蒋红梅, 张忠兴. 微米级铜-银双金属粉镀层结构及其抗氧化性[J]. 物理化学学报,
2000, 16(04): 366-369.
doi:
10.3866/PKU.WHXB20000414
Citation: Gao Bai-Jiao, Gao Jian-Feng, Jiang Hong-Mei, Zhang Zhong-Xing. Plating Structure and Antioxygention of Micron Cu-Ag Bimetallic Powder[J]. Acta Physico-Chimica Sinica, 2000, 16(04): 366-369. doi: 10.3866/PKU.WHXB20000414
Citation: Gao Bai-Jiao, Gao Jian-Feng, Jiang Hong-Mei, Zhang Zhong-Xing. Plating Structure and Antioxygention of Micron Cu-Ag Bimetallic Powder[J]. Acta Physico-Chimica Sinica, 2000, 16(04): 366-369. doi: 10.3866/PKU.WHXB20000414
English
Plating Structure and Antioxygention of Micron Cu-Ag Bimetallic Powder
Abstract:
The correlation of plating structure with the antioxygenation of micro Cu-Ag bimetallic powder was studied by SEM、XRD、TG and other means. It was found that copper powder plated with silver having an interspersion structure posesses antioxygenation at normal atmospheric temperature as surface Ag content reaches above 15.22%, the temperature of oxidation resistance varies with the surface Ag content. The greater the surface Ag content is, the higher the temperature of antioxygenation for bimetalic powder with the plating interspersion structure. The copper powder plated by silver with full packaging structure can not be oxidized even at 700℃.
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Key words:
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Cu-Ag bimetallic powder
- / Surface structure
- / Oxidation resistence
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